Examination and simulation of the electromagnetic impact on electronic components

Document Type : Original Article

Authors

1 Assistant Professor, Malik Ashtar University of Technology, Tehran, Iran

2 department faculty of Malek-ashtar university

Abstract

Sensors are one of the most vulnerable electronic devices to high-power electromagnetic waves such as (HPEM), (UWB), and (EMP). To achieve such effects, a model of the effect of electromagnetic interference has been proposed. The susceptibility of such components to waves by finite element software (COMSOL MULTYPHYSIC) is simulated and vulnerability has been investigated. The results show the destruction of electronic components in the sensor during attacks. When the frequency of the pulse carrier is similar to the operating frequency of the target, it will be much higher. Parameters such as the angle of radiation or the proximity of the elements used in the sensor can also increase or decrease the degradability of the target. In this paper, the factors affecting the vulnerability of components during the emission of high-powered electromagnetic waves will be investigated and finally, the degree of damage will be shown.

Keywords


[1]    M. Ayaz, M. Ammad-uddin, I. Baig, and E. -H. M. Aggoune, “Wireless Sensor’s Civil Applications, Prototypes, and Future Integration Possibilities: A Review,” In IEEE Sensors Journal, vol. 18, pp. 4-30, 2018.
[2]    D. Zhang, X. Zhou, E. Cheng, H. Wan, and Y. Chen, “Investigation on Effects of HPM Pulse on UAV's Datalink,” In IEEE Transactions on Electromagnetic Compatibility, vol. 62, pp. 829-839, June 2020. 
[3]    M. Rohe, S. Korte, and M. Koch. “Susceptibility of Electronic Systems to High-Power Microwaves: Summary of Test Experience,” In IEEE Transactions on Electromagnetic Compatibility, Vol. 46, pp. 396-403,August 2004.
[4]    M. Mehri and S. Heidari, “The Analysis of EMI Effects on the Performance of Electronic Systems Implemented on a PCB,” vol. 31, 
pp. 100-105, 2012.
[5]    Amin, A., Salehi, A., Ghezelayagh, M. H., & Ghanegharabagh, Y. “Three dimensional Simulation and Testing of Radiative Electromagnetic Wave Characteristics on Electronic Circuits Using FDTD Method” The Modares Journal of Electrical Engineering, 10(2), 61-72,2010.
[6]    M. O'hara, “ EMC at Component and PCB Level.”; Elsevier, 1998. 
[7]    J. L. Lagos and Franco Fiori, "Worst-case induced disturbances in digital and analog interchip interconnects by an external electromagnetic plane wave—Part I: Modeling and algorithm." IEEE Transactions on Electromagnetic Compatibility, vol. 53, No. 1, pp. 178-184, 2010.
[8]    Zhou, Liang, Zheng Wei San, Yu-Jie Hua, Liang Lin, Shuo Zhang, Zheng Guo Zhao, Hai Jing Zhou, and Wen-Yan Yin,  [M1] [H2] “Investigation on Failure Mechanisms of GaN HEMT Caused by High-Power Microwave (HPM) pulses,” In IEEE Transactions on Electromagnetic Compatibility, vol. 59, No. 3, pp. 902–909, June 2017.
[9]    M. Leone, “Radiated Susceptibility on the Printed-Circuit-Board Level: Simulation and Measurement,” In IEEE Transactions on Electromagnetic Compatibility, vol. 47, pp. 471-478, August 2005.
[10]   K. Mandeep, K. Shikha, and M. Danvir, “Electromagnetic Interference,” IEEE Transactions on Electromagnetic Compatibility, vol. 3, pp. 1–5, April 2011.
[11]  L. Zhou, Sh. Zhang, W.-Y. Yin, and J.-F. Mao “Immunity Analysis and Experimental Investigation of a Low-Noise AmplifierUsing a Transient Voltage Suppressor Diode Under Direct CurrentInjection of HPM Pulses,” In IEEE Transactions on Electromagnetic Compatibility, vol. 56, pp. 1715-1718, December 2014.
[12]  W. A. Radasky, C. E. Baum, and M. W. Wik, “Introduction to the Special Issue on High-Power Electromagnetics (HPEM) and Intentional Electromagnetic Interference (IEMI),” IEEE Transactions on Electromagnetic Compatibility, vol. 46, pp. 314–321, August 2004.
[13]  CMOS TTL Logic Family List Datasheets,” CMOS, TTL VOLTAGE-LEVEL, ELECTRICAL CHARACTERISTICS “https://www.datasheetarchive.com/TTL%20catalog-datasheet.html [M3] , 2008.
[14]  A. J. Shokri , M. H. Tavakoli, A. A. Sabouri Dodaran, and M. S. Akhoundi Khezrabad, “Numerical Study of Influence of Coil Step on the Induction Heating Process in Three- Dimensional,” Journal of Applied Electromagnetics, vol. 4, pp. 37-44, 2016(In Persian). 
Volume 10, Issue 2 - Serial Number 25
October 2022
Pages 115-124
  • Receive Date: 13 November 2021
  • Revise Date: 23 January 2022
  • Accept Date: 06 July 2022
  • Publish Date: 23 October 2022